01 · High surface area
Assembled heat sinks
Heat sinks manufactured by joining base and fins to increase heat exchange surface, reduce fin spacing and improve performance in high-density designs.
Aluminium and copper thermal solutions for power semiconductors, IGBT modules, rectifiers, converters, traction equipment, welding systems, renewable energy, UPS and industrial electronics.
TOT POWER Iberia supplies standard and custom heat sink solutions, with technical-commercial support for profile selection, machining, assembly, air or liquid cooling and adaptation to existing designs.
Assembled heat sinks and thermal solutions for demanding industrial equipment.
In power electronics, the heat sink is not just a mechanical accessory. It is a critical element for equipment reliability, semiconductor lifetime and thermal stability of the complete assembly.
We work with extruded, assembled, welded and embedded heat sinks, coldplates and clamping systems for press-pack semiconductors. We can supply solutions for new designs, spare parts, maintenance, retrofit projects or replacement of existing references.
Our approach combines thermal, mechanical and assembly criteria: thermal resistance, profile mass, airflow, useful surface area, machining, finishes, insulation, tightening torque and semiconductor compatibility.
Product families for industrial electronics, power conversion equipment and applications where thermal dissipation directly affects system reliability.
Heat sinks manufactured by joining base and fins to increase heat exchange surface, reduce fin spacing and improve performance in high-density designs.
High-efficiency solutions obtained by joining pressed modules, suitable when high thermal performance is required in compact spaces with optimized airflow channels.
Large-section profiles with high thermal inertia for rectifiers, converters, drives, traction, welding, UPS and industrial equipment with high current and high thermal losses.
Heat sinks manufactured by welding one or several profiles together, designed to achieve widths and surfaces that would not be feasible with a single extruded profile.
Profiles with fixing guide to simplify mechanical installation on structures, frames or chassis. Suitable for equipment requiring robust and repeatable mounting.
Solutions for diodes, thyristors and disc-type semiconductors, designed to work with controlled contact pressure, efficient heat transfer and mechanical stability.
Profiles machined with transverse cuts in the fins to improve ventilation, support airflow and distribute dissipation in natural or forced convection applications.
A balanced range in terms of thermal performance, weight, volume and ease of machining. Suitable for power supplies, controllers, converters and general industrial electronics.
Liquid-cooled plates for power modules, IGBT, SiC, MOSFET and high thermal density assemblies. Suitable when air cooling is not sufficient or not feasible.
Pre-calibrated clamping systems for disc diodes and thyristors. They apply controlled mechanical pressure, protect the semiconductor and ensure thermal and electrical contact.
Lightweight profiles for lower thermal dissipation applications, control electronics, small power supplies, compact converters and equipment where easy assembly is a priority.
Heat sinks with elastic retaining elements for quick component fixing, without special machining and with sufficient pressure to maintain thermal contact.
We support both technical purchasing and engineering teams in defining the most suitable heat sink for each application, including standard solutions, modification of existing profiles or development of specific parts.
Cutting, drilling, threading, milling and specific machining on aluminium or copper profiles, based on drawings or existing samples.
Adaptation of 2D/3D models, definition of mounting holes, contact areas, housings and special geometries for the equipment.
Study of thermal resistance, dissipated power, airflow, ambient temperature and maximum allowable semiconductor temperature.
Selection of existing profiles or development of specific solutions when geometry, power level or mounting conditions require it.
Possibility of anodizing, protective treatments, functional finishes and surface preparation according to electrical, thermal or environmental requirements.
Verification of machining, critical tolerances and compatibility with power modules, disc semiconductors, clamps or existing assemblies.
Heat sinks must be selected together with the semiconductor, fixing system, ventilation and working environment. A reference that appears similar can perform very differently if length, machining, airflow or contact pressure change.
TOT POWER Iberia can help review the application and propose a compatible solution, both for new designs and for maintenance of existing industrial equipment.
We supply thermal solutions for equipment manufacturers, engineering companies, industrial maintenance teams, integrators and technical purchasing departments.
We can start from a drawing, sample, existing reference or thermal data from the application. From there, we review the real requirement: power, available space, semiconductor type, ventilation, machining and environmental conditions.
Review of dissipated power, ambient temperature, mounting type and operating conditions.
Standard profile, assembled heat sink, welded solution, embedded heat sink, coldplate or specific design.
Mechanical adaptation of the heat sink with holes, threads, milling and surface treatment.
Delivery of parts for prototype, series production, maintenance, retrofit or industrial spare parts.
To select a heat sink correctly, electrical, thermal and mechanical data should be considered. It is not always necessary to have all the information at the beginning, but the more data provided, the more accurate the study will be.
We can also review alternatives for existing heat sinks, old assemblies or references with limited availability.
Yes. We can work with machined standard profiles, assembled heat sinks, welded solutions, coldplates or designs adapted to the thermal and mechanical requirements of the equipment.
Yes. We can study parts based on drawings, physical samples or existing references, including cutting, CNC machining, drilling, threading, milling and surface finishes.
An extruded heat sink is based on a single profile. An assembled heat sink increases fin surface by joining base and fins. A welded heat sink allows widths or geometries that would not be feasible with a single extruded profile.
A coldplate is recommended when power density is high, available space is limited or air cooling cannot keep the semiconductor temperature within safe limits.
Yes. We can supply clamps and cooling solutions for disc diodes, thyristors and semiconductors, taking into account contact pressure, mechanical mounting and heat transfer.
Yes. We can review photographs, dimensions, drawings or old references to study a compatible solution or a current alternative machined according to the equipment requirements.
Send us your enquiry and we will review the most suitable thermal solution for your application. You can attach a drawing, photograph, current reference, semiconductor data or equipment description.
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